EQS-News: AT&S and IFC sign sustainability-linked loan agreement to finance integrated circuit substrate plant in Malaysia

EQS-News: AT&S Austria Technologie & Systemtechnik AG / Key word(s):
Financing/Sustainability
AT&S and IFC sign sustainability-linked loan agreement to finance
integrated circuit substrate plant in Malaysia (news with additional
features)

13.03.2025 / 06:58 CET/CEST
The issuer is solely responsible for the content of this announcement.

══════════════════════════════════════════════════════════════════════════

AT&S and IFC sign sustainability-linked loan agreement to finance
integrated circuit substrate plant in Malaysia

 

The International Finance Corporation— a member of the World Bank Group
—confirmed a 250 million US-dollar loan for AT&S to further develop the
AT&S plant in Kulim, Malaysia.

Leoben, March 13, 2025 – Yesterday evening, the International Finance
Corporation (IFC), a member of the World Bank Group and the largest global
development institution focused on the private sector in emerging markets,
and AT&S have signed a sustainability-linked loan agreement for 250
million US dollars at the AT&S headquarters in Leoben-Hinterberg. The loan
supports investment in a modern integrated circuit (IC) substrate plant in
Kulim, Malaysia. The 250 million US-dollar loan will come directly from
IFC; an additional up to 150 million US dollars could be provided by local
banks under the same agreement.

The sustainability-linked loan features financial incentives tied to AT&S
lowering its annual greenhouse-gas emissions by 31 percent by the year
ending March 31, 2028, compared to the baseline for fiscal year 2022.

“We are delighted to have the support of IFC as partner in our growth,”
says CFO Petra Preining. “Despite a challenging market environment, we are
continuing to expand our plant in Kulim; for AMD’s data center processors
AT&S Malaysia will start delivering high-end integrated circuit substrates
soon.”

“We’re excited to partner with AT&S on this financing, which ranks as one
of the first sustainability-linked loans in Malaysia’s electrical and
electronics products industry,” said Carsten Mueller, Regional Industry
Director, Manufacturing, Agribusiness and Services, Asia and the Pacific
at IFC. “Our investment will help to advance Malaysia’s semiconductor
manufacturing ecosystem, while supporting the country in achieving its
sustainability goals.”

The loan will support AT&S to further develop the new AT&S plants in
Kulim, Malaysia to produce advanced IC substrates that are an integral
part of processors for high-performance computing, data centers and AI
infrastructure. The facilities in Kulim were built to the highest quality
and sustainability standards, with state-of-the-art machinery, recycling
systems and a sustainable energy concept.

 

IFC

IFC — a member of the World Bank Group — is the largest global development
institution focused on the private sector in emerging markets. We work in
more than 100 countries, using our capital, expertise, and influence to
create markets and opportunities in developing countries. In fiscal year
2024, IFC committed a record $56 billion to private companies and
financial institutions in developing countries, leveraging private sector
solutions and mobilizing private capital to create a world free of poverty
on a livable planet. For more information, visit www.ifc.org.

 

AT&S Austria Technologie & Systemtechnik Aktiengesellschaft – Advanced
Technologies & Solutions

AT&S is a leading global manufacturer of high-end IC substrates and
printed circuit boards. AT&S industrializes leading-edge technologies for
its core business segments Mobile Devices & Substrates, Automotive &
Aerospace, Industrial and Medical and high-performance computing for VR
and AI applications. AT&S has a global presence with production sites in
Austria (Leoben, Fehring) as well as plants in India (Nanjangud) and China
(Shanghai, Chongqing). A new high-end production site for IC substrates is
currently being established in Malaysia (Kulim). In Leoben, a European
competence center including series production for IC substrate
technologies is being built. Both sites will start production in the
financial year 2024/25. The company currently employs 13,000 people. For
further information please visit [1] www.ats.net

 

══════════════════════════════════════════════════════════════════════════

Additional features:

File: [2]© AT&S

══════════════════════════════════════════════════════════════════════════

13.03.2025 CET/CEST This Corporate News was distributed by EQS Group.
www.eqs.com

══════════════════════════════════════════════════════════════════════════

Language: English
Company: AT&S Austria Technologie & Systemtechnik AG
Fabriksgasse 13
8700 Leoben
Austria
Phone: +43 (1) 3842200-0
E-mail: ir@ats.net
Internet: www.ats.net
ISIN: AT0000969985, AT0000A09S02
WKN: 922230
Indices: ATX
Listed: Regulated Unofficial Market in Berlin, Dusseldorf, Frankfurt,
Hamburg, Hanover, Munich, Stuttgart, Tradegate Exchange;
Vienna Stock Exchange (Official Market)
EQS News ID: 2099794

 
End of News EQS News Service

2099794  13.03.2025 CET/CEST

https://eqs-cockpit.com/cgi-bin/fncls.ssp?fn=show_t_gif&application_id=2099794&application_name=news&site_id=apa_ots_austria~~

References

~~18b544d0-9c71-4160-bd95-cc8b9aff9fbf&application_name=news
2. https://eqs-cockpit.com/cgi-bin/fncls.ssp?fn=redirect&url=3ffd6316592a4fdd7845240001795f7d&application_id=2099794&site_id=apa_ots_austria~~~18b544d0-9c71-4160-bd95-cc8b9aff9fbf&application_name=news

OTS-ORIGINALTEXT PRESSEAUSSENDUNG UNTER AUSSCHLIESSLICHER INHALTLICHER VERANTWORTUNG DES AUSSENDERS. www.ots.at
© Copyright APA-OTS Originaltext-Service GmbH und der jeweilige Aussender